Terms of Use
Circuit Board Assembly
SMT Hautes Technologies assembles approximately 1.4 million electronics cards annually. The range of products assembled in our factory is very varied. Placements 01005 and 0.3 mm BGA pitch and the package on package (POP) technologies are commonly used in our manufacture. To the simple to the complex boards, some contain more than 7200 placements, SMT meets all your manufacturing requirements.
 
Our company over the years has developed a great expertise in box build assembly and finished good products. The full computerization of our production floor  , the assembly processes and inspection allow us to provide the highest quality to our customers. The assembly of printed circuit boards to finished good product, SMT offers the full turnkey manufacturing solution.
Box Build
Francais